Electronics Forum | Mon Jul 14 16:29:57 EDT 2008 | patrickbruneel
Stephen, Correct when focusing just on contact length and time only contact time should change when changing the conveyer speed (when the machine is in good operating condition). Changing the conveyer speed changes a lot more parameters like: *Flu
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Thu Jan 14 15:10:14 EST 1999 | Earl Moon
| | Hi Folks. Has any Process Engineer here done a complete evaluation or controlled experiment for VOC-FREE Flux? Our goal here at CEBUKid, Inc. is to implement a VOC-FREE process. We have all the necessary (OPTIFLUX) spray equipment, and we're c
Electronics Forum | Mon Jun 07 11:10:56 EDT 1999 | Brian Wycoff
| | | | | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area
Electronics Forum | Fri Nov 21 14:11:09 EST 2003 | russ
We have a customer with the same requirements. We use a hot air pen to rework the caps. This is supposed to eliminate the thermal shock that is present when a soldering iron is used. The solder iron tip temp is usually 600-700 degrees and comes int
Electronics Forum | Fri Jun 23 14:10:01 EDT 2000 | Chrys Shea
Sounds like the mask to me. Had a similar situation a couple years ago. The mask wasn't fully cured, so it absorbed water that the preheaters couldn't dry out. When it outgassed at the wave, it caused a lot of micro turbulence that broke the surfa
Electronics Forum | Mon Sep 11 09:39:31 EDT 2000 | Chris May
Charlie, Check: a)That your wave is not too high/powerful as this will push up components due to force exerted by mass of solder b)That your conveyor is set at optimimu height so that a) is not required. If conveyor is too high, then the wave will
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Mon Jul 14 16:11:58 EDT 2008 | ck_the_flip
Pat, Try to run a glass plate (yeah I've used these before too), keep your wave pump speed the same, and slow down your conveyor speed. You will find the actual contact between molten solder and the 0.5" grids to be LESS vs. a faster conveyor speed
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